Subhan Arshad
Open to work0 years experienceMechanical Engineer
Mechanical Engineering student with experience in semiconductor packaging and equipment engineering.
Standing Rank
Rank Not Available
Developer Badges
Skills & Technologies
21 skillsWork Experience
CVD Equipment Engineer Intern
TSMC Arizona
- Developed and deployed an Excel VBA troubleshooting model for HDP turbo-throttle valve alarms, projected to cut troubleshooting time 50% from 4 to 2 hours
- Analyzed SPC/FDC trends, chamber-pressure data, valve behavior, and alarm histories to identify out-of-range conditions and automate fine-tuning logic
- Addressed a recurring production alarm observed seven times in one month, improving troubleshooting consistency and potentially saving 14 engineering hours monthly
- Supported CVD tool troubleshooting involving RF generators, plasma sources, chamber stability, preventive maintenance, and equipment recovery
Undergraduate Research Assistant, Packaging Research Center
Georgia Institute of Technology
- Supporting graduate researchers on semiconductor packaging-related work involving package development, characterization, and experimental support
- Gaining exposure to packaging workflows, lab practices, and reliability-driven package design considerations
Mechanical CFD Engineer Intern
Lotus Power
- Developed ANSYS CFD models to analyze airflow and heat transfer in an incubator for thermal design validation
Projects
Flip-Chip BGA Semiconductor Package Thermal & Structural FEA
- Built a detailed 3D flip-chip BGA package model in SolidWorks including silicon die, solder bump array, underfill, copper pads, and organic substrate
- Performed steady-state thermal FEA in ANSYS Mechanical to evaluate junction temperature, thermal resistance, and package heat-dissipation paths
- Conducted thermo-mechanical analysis using imported temperature fields to study CTE-induced stress, package warpage, and solder interconnect reliability trends
- Used the package stackup and simulation results to better understand design tradeoffs relevant to semiconductor package performance and reliability
Mechanical Robot Design and Fabrication
- Engineered and fabricated a competition-ready robot using SolidWorks CAD, 3D printing, and laser cutting
- Integrated an Arduino-based mechatronics system controlling motors, solenoids, and pneumatic actuators, achieving 95% actuation reliability during iterative testing
- Performed iterative prototyping, debugging, and root-cause analysis on mechanism failures; design changes improved mission efficiency by 15%
Scooter CAD and FEA Analysis
- Modeled a full scooter assembly in Siemens NX including wheel, axle, accelerator, and frame components
- Conducted structural FEA under rider and braking loads to evaluate stress and deflection behavior
- Validated results with analytical beam-bending calculations and mesh convergence studies
Leaderboard Standings
Leaderboard Position Pending
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Assessment Highlights
Assessments Not Completed
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AI Collaboration Score
AI Collaboration Score Pending
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Role Compatibility Profile
Role Compatibility Analysis Pending
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Achievements
Achievements Not Earned
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About Details
Professional Bio
Mechanical Engineering student at Georgia Tech with experience in semiconductor packaging, CVD equipment, and CFD analysis. Skilled in CAD, FEA, and programming with a focus on thermal and structural design.
B.S. Mechanical Engineering in Mechanical Engineering
Georgia Institute of Technology (2023 - 2026)