Taichung - Fab 16, Taiwan
Onsite
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Director of Process Development in Advanced Packaging Technology Development (APTD) within Micron, you will provide strategic and technical leadership for the development and deployment of advanced packaging assembly processes enabling next-generation memory products. You will collaborate with internal and external stakeholders to define and execute technology development strategies aligned with organizational and business objectives. Your team will be responsible for developing scalable, manufacturable, and cost-effective assembly processes that deliver industry-leading performance, quality, yield, and reliability.
You will drive innovation across advanced packaging technologies including 2.5D, 3DIC, hybrid bonding, wafer-level and panel-level packaging, advanced interconnect solutions, and emerging assembly platforms. You will lead process development from concept through technology qualification, productization, and high-volume manufacturing transfer while ensuring alignment with Technology Development business processes.
In this role, you will develop organizational capability through leadership coaching, talent development, succession planning, and strategic workforce planning. You will establish performance metrics, drive continuous improvement initiatives, and provide organizational leadership in developing department strategies, technology roadmaps, and cross-functional execution plans.
Responsibilities include, but are not limited to, the following:
Technology Strategy and Roadmap Development
Develop and communicate advanced packaging process technology strategies aligned with Micron's long-term product and technology roadmap.
Define process development roadmaps for next-generation packaging platforms.
Evaluate emerging assembly technologies, materials, and equipment solutions to identify future competitive advantages.
Understand market, product, and technology trends and translate them into executable development strategies.
Influence organizational investment decisions through data-driven technical recommendations.
Process Technology Leadership
Establish strategic and long-term technical objectives for assembly process development organizations.
Drive innovation in die attach, hybrid bonding, thermocompression bonding, molding, underfill, substrate assembly, singulation, and related packaging processes.
Lead development of scalable manufacturing solutions for advanced packaging technologies.
Champion process architecture decisions balancing performance, manufacturability, cost, reliability, and cycle time.
Drive breakthrough solutions for challenging yield, reliability, and process integration problems.
Product Development and Manufacturing Readiness
Lead process development activities from concept through qualification and manufacturing transfer.
Ensure development projects meet technology milestones, quality expectations, and business objectives.
Drive manufacturability improvements through process optimization and design enablement.
Ensure process capability, yield targets, cost objectives, and reliability requirements are achieved.
Establish development methodologies, best practices, and qualification strategies.
Cross-Functional Leadership
Represent APTD Process Development in company-wide technical and business initiatives.
Partner with Process Integration, Design, Product Engineering, Reliability, Manufacturing, Procurement, Quality, and Supply Chain organizations.
Develop strategic partnerships with equipment and material suppliers.
Lead cross-functional teams in resolving complex technical and operational challenges.
Influence internal and external stakeholders without direct authority.
Organizational Leadership
Build and develop a high-performing technical organization.
Create a culture focused on innovation, collaboration, accountability, and continuous improvement.
Establish succession plans and organizational capability roadmaps.
Mentor managers, technical leaders, and emerging talent.
Drive employee engagement, inclusion, and leadership development initiatives.
Business Impact and Execution
Ensure critical deliverables, milestones, and business objectives are achieved.
Guide effective utilization of personnel, capital, and equipment resources.
Drive productivity improvements, cycle-time reduction, and cost optimization initiatives.
Make decisions that directly impact product competitiveness and organizational success.
Monitor and communicate key performance indicators to senior leadership.
Continuous Improvement and Growth
Apply Artificial Intelligence to promote adoption of new technologies, data science methodologies, and advanced analytics.
Foster a growth mindset within the organization.
Drive continuous improvement in process development methodologies and execution efficiency.
Encourage cross-functional learning and knowledge sharing.
Qualifications and Skills
Experience
Minimum 12 years of semiconductor industry experience with at least 5 years in advanced packaging technology development.
Minimum 5 years of leadership experience managing managers and/or large technical organizations.
Demonstrated success developing and qualifying advanced packaging technologies from concept to manufacturing.
Experience working with global teams and external technology partners.
Technical Expertise
Strong knowledge in one or more of the following areas: 2.5D and 3D packaging technologies; hybrid bonding (D2W, W2W, C2W); HBM and heterogeneous integration; advanced assembly processes and materials; wafer-level packaging and fan-out technologies; reliability engineering and qualification methodologies; semiconductor manufacturing equipment and process control; yield improvement and failure analysis; and process characterization, DOE, and statistical methodologies.
Data and Analytical Skills
Excellent data extraction, analytics, and visualization skills.
Experience with JMP, Python, R, SQL, or equivalent analytical tools.
Strong understanding of process capability, statistical process control, and experimental design.
Ability to translate data into actionable technical and business decisions.
Leadership Competencies
Proven ability to lead large and diverse organizations.
Strong strategic thinking and technology vision.
Excellent stakeholder management and influencing skills.
Ability to navigate ambiguity and drive execution under tight timelines.
Outstanding verbal, written, and executive presentation skills.
Strong customer and product focus.
Demonstrated ability to build effective partnerships across global organizations.
Education
MS or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Chemistry, Computer Engineering, or a related technical field.
Recommended Micron-Specific Scope
The following expectations may be retained when the role is specifically scoped to Package 3DI Assembly and next-generation HBM enablement:
Own the Advanced assembly technology roadmap.
Lead supplier co-development strategy across key equipment and material partners.
Drive technology transfer across Taiwan, Singapore, and Boise.
Advance AI enabled process optimization and intelligent manufacturing initiatives.
Lead capital strategy and development-equipment investment planning.
Ensure scalable manufacturing readiness for HBM4E, HBM5, and next-generation 3D packaging platforms.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com.
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
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