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Corvallis, Oregon, United States
Onsite
Description -
This is an expert level Product Engineering position within HP’s imaging and printing business within the Microfluidic Platform Development Organization (MPD). Our print technology includes the merging of complex design constraints, the use of material combinations and extensive product testing/qualification to deliver high quality products that provide excellent end user performance. This includes the combination and interaction of polymers, ceramics, metals, elastomers, multilayer films and electronics using mechanical, fluidic, electrical, adhesion, thermal and chemical manufacturing processes. A product engineer monitors these processes to ensure product requirements are met or exceeded. This individual will need be able to apply advanced TIJ knowledge to solve complex business issues.
NPI Product Engineering – What you will do
- Lead cross-functional teams to understand customer (product) and manufacturing (process) requirements. This will include the ability to manage projects with multiple workstreams and deliverables, and effectively communicate goals, objectives, timeline, budget, risks, and costs.
-Lead a worldwide product engineering team, in collaboration with R&D, to develop and characterize test methods to minimize or eliminate risks and ensure the product meets the end-customer requirements. This will include ability to lead others in the development of solution design, validation methodology, tooling and testing.
-Provides TIJ domain-specific expertise and overall leadership and perspective to cross-organization projects, programs, and activities to ensure risk aversion and successful delivery of key program & business deliverables.
-Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents to present to stakeholders, articulate clear trade-offs from a business context and recommend a path forward.
-Drive the evaluation and review of Design for Manufacturability (DFM) and Lead Development Effectiveness in new product development to reduce risk at launch of new products.
-Using DOE characterization and subsequent results, refine specifications end-to-end (product to process) to ensure a shippable product. This includes material, process and other variations.
-Lead cross-functional team to drive root cause evaluation and issue resolution as problems arise in proto and production. Including strong understanding of TIJ to triage proto and production parts to determine cause of failure.
-Serve as key final assembly focal in supporting the efforts of other key organizations such as the Fab, equipment/tooling design teams, product engineering and printer teams to ensure E2E quality.
-Provides guidance and mentoring to less experienced staff members.
-Lead worldwide product engineering team to deliver clear documentation, reporting and communication of product quality requirements.
-Drive the WW product engineering team and manufacturing partners to complete margin studies to ensure we have a clear path to stability.
-Partner with other organizations to drive product investigations/issue escalations for released products, including leading escalations that impact multiple workstreams
-Manage and develop framework for qualification of change of the released product.
-Understand data connectivity methods used in part tracking within and across factories. Serves as key stakeholder in E2E data with IT partners to ensure data connectivity exists and is data retrieval is operationally correct as materials and parts/assemblies move from one factory to another, often across borders and continents.
-Drive WW teams to ensure the capture of critical knowledge.
-Drive any transfer activities to high volume factories.
-Work on complex problems where analysis of situations or data requires an in-depth evaluation of multiple factors.
Qualifications
Desirable skills as follows
Salary
The pay range for this role is $116,150 to $182,400 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Disclaimer
This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management, and whether the requisition opens to internal candidates first.
Job -
EngineeringSchedule -
Full timeShift -
Shift 1, 0% premium (United States of America)Travel -
25%Relocation -
NoEqual Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"
