晶圓廠設備工程師 Fab Equipment Engineer

在美光（Micron），我們打造記憶體與儲存解決方案，驅動各項改變世界運作、學習與連結方式的科技。我們正在尋找充滿熱忱的夥伴加入我們，共同推動半導體產業的成長與創新。 

身為設備工程師，您將透過解決複雜的技術挑戰、對設備效能負起端到端的責任，並與製造、製程工程、維護及供應商團隊緊密合作，確保先進半導體製造設備的可靠性、效能與持續改善。身為美光 AI 賦能生態系的一環，晶圓廠設備工程師運用 AI 輔助資料、設備健康狀態洞察與進階分析，全面提升晶圓製造的機台效能、可靠性、問題排除能力與持續改善。 

At Micron, we create memory and storage solutions that power the technologies transforming how the world works, learns, and connects. We are looking for passionate individuals to join us in driving growth and innovation across the semiconductor industry. 

As an Equipment Engineer, you will solve complex technical challenges, take end-to-end ownership of equipment performance, and collaborate closely with Manufacturing, Process Engineering, Maintenance, and Supplier teams to ensure the reliability, performance, and continuous improvement of advanced semiconductor manufacturing equipment. As part of Micron’s AI-enabled ecosystem, Fab Equipment Engineers leverage AI-assisted data, equipment health insights, and advanced analytics to optimize tool performance, enhance reliability, accelerate troubleshooting, and drive continuous improvement across wafer manufacturing operations. 

工作職責（RESPONSIBILITIES） 

• 透過發掘問題、推動矯正措施及生命週期改善策略，對設備效能與可靠性負起責任 

• 運用結構化的問題解決方法診斷技術問題，促成機台快速復機，並預防潛在問題發生 

• 推動設備升級／改造專案，導入硬體解決方案，並與供應商合作解決問題 

• 跨部門協作（製程、製造、廠務、品質、維護團隊），共同解決問題 

• 向利害關係人溝通分析結果與建議事項 

• 建立並維護標準作業程序（SOP）與問題排除指南，並推動知識分享 

• 確保符合安全、品質與製造相關標準 

  Own and continuously improve equipment performance and reliability through proactive issue identification, corrective actions, and lifecycle optimization initiatives.  

  Apply structured troubleshooting and root-cause analysis techniques to resolve equipment issues efficiently and minimize manufacturing disruptions.  

  Drive equipment upgrade, modification, and installation projects, partnering with suppliers to implement sustainable engineering solutions.  

  Collaborate closely with Process, Manufacturing, Facilities, Quality, and Maintenance teams to solve complex operational challenges and improve production outcomes.  

  Present technical analyses, recommendations, and project updates to key stakeholders.  

  Create, maintain, and enhance operational procedures, troubleshooting documentation, and knowledge-sharing practices.  

  Champion compliance with safety, quality, and manufacturing requirements while fostering a culture of continuous improvement. 

基本要求（MINIMUM REQUIREMENTS） 

• 相關技術領域之學士學位或進階證照，或同等之技術類軍事經驗，或學歷與相關經驗之組合 

• 優先考量之科系包含電機工程、機械工程、化學工程、材料科學、製造、機電整合、工業工程 

• 願意且能夠：整個班次於高低不平或狹窄的地面站立與行走、穿戴個人防護裝備（PPE）與無塵服、彎腰、跪姿及攀爬以觸及機台、需要時搬運重達 40 磅(18公斤)的物品 

• 願意配合 12 小時輪班制度（含日班、夜班、週末及假日班），並依公司規定安排用餐與休息時間，以支援 24/7 全天候製造營運運作。 

  Bachelor's degree in Engineering, Applied Sciences, or a related technical discipline; equivalent military technical experience or a combination of education and relevant experience will also be considered.  

• Preferred Majors: Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Manufacturing Engineering, Mechatronics Engineering, or Industrial Engineering. 

  Ability to work in a semiconductor manufacturing cleanroom environment and perform physical job requirements, including standing and walking for extended periods, wearing PPE and cleanroom garments, bending, kneeling, climbing, and lifting up to 40 pounds (18 kg) when required.  

  Willingness to work a rotating 12-hour rotating shifts with scheduled meal and rest breaks., including day and night shifts, weekends, and holidays, to support a 24/7 manufacturing operation. 

基本資格條件（MINIMUM QUALIFICATIONS） 

可透過學歷、實習、研究、軍事技術訓練、製造或專業經驗展現。 

• 技術問題排除與問題解決、根本原因分析、設備／系統診斷、資料分析與判讀 

• 統計製程管制（SPC）原理、持續改善 

• 具備機械、電機、自動化及製造系統相關經驗 

• 技術文件撰寫與溝通 

• 跨部門協作與團隊合作 

• 以客戶與利害關係人為導向的有效溝通 

• 展現當責與主動精神，能適應新環境 

• 注重細節、分析思維 

The following qualifications and skills may be demonstrated through academic coursework, internships, research projects, military technical training, manufacturing experience, or other relevant professional experience. 

• Technical troubleshooting, problem-solving, root cause analysis, equipment/system diagnostics, and data analysis. 

• Knowledge of Statistical Process Control (SPC) principles and continuous improvement methodologies. 

• Experience in mechanical, electrical, automation, and manufacturing systems. 

• Technical documentation and communication skills. 

• Strong cross-functional collaboration and teamwork abilities. 

• Effective customer- and stakeholder-focused communication skills. 

• Demonstrated ownership, initiative, adaptability, and willingness to learn in new environments. 

• Strong attention to detail and analytical thinking skills. 

加分資格條件（PREFERRED QUALIFICATIONS） 

具備以下一項或多項之經驗或接觸者： 

半導體製造 · 大量生產 · 設備維護與可靠性 · 機器人與自動化 · 真空系統 · 工業控制系統 · SPC · FDC · 製造執行系統（MES） · 製程改善 · 設備驗證與確效 

Experience or familiarity with one or more of the following is considered a plus: 

• Semiconductor manufacturing environments 

• High-volume production operations 

• Equipment reliability, maintenance, and performance optimization 

• Robotics, automation, and automated material handling systems 

• Vacuum technology and vacuum systems 

• Industrial automation and control systems 

• Statistical Process Control (SPC) 

• Fault Detection and Classification (FDC) 

• Manufacturing Execution Systems (MES) 

• Continuous process improvement methodologies 

• Equipment commissioning, qualification, and validation