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•Project Title: Technical Investigation of 3D‑NAND Physical Failure Analysis Workflows for Automation and AI Implementation Opportunities

•Project Description:

•Physical Failure Analysis (PFA) of 3D‑NAND flash memory plays a critical role in enabling yield ramp, reliability qualification, and customer failure resolution. Compared to traditional planar devices, 3D‑NAND PFA inherently exhibits longer and more variable cycle time due to its vertically stacked architecture, extreme aspect‑ratio features, and strong dependence on accurate failure localization. PFA cycle time is not merely a lab efficiency metric; it directly impacts yield‑learning speed during technology ramp, effectiveness of corrective actions, and response time for customer returns and reliability excursions. Understanding and addressing the technical sources of PFA cycle‑time inflation is therefore essential for advanced NAND manufacturing.

–In this project, the student will analyze the end‑to‑end PFA workflow for 3D‑NAND devices to identify cycle‑time bottlenecks, complexity drivers, and sources of variability. Based on this analysis, the project will define targeted automation and AI implementation opportunities to improve lab efficiency, reduce turnaround time, and enhance analysis consistency.

–The student will receive on‑the‑job training in PFA concepts and techniques and will work closely with experienced engineers and mentors to apply analytical thinking and solving skills to real manufacturing problems. This project offers hands‑on exposure to industrial PFA practices, multi-functional collaboration, and the opportunity to make measurable impact on cycle time and yield learning for advanced 3D‑NAND technologies.

The outcomes of this project are expected to directly influence PFA cycle‑time targets and yield‑learning efficiency for next‑generation 3D‑NAND technologies.

•Scope: Gain hands‑on exposure to semiconductor fabrication processes, 3D‑NAND device structures, and their associated physical failure analysis (PFA) concepts. The student will learn operating principles and perform practical work on innovative tools including Reactive Ion Etching (RIE), Scanning Electron Microscopy (SEM), and Focused Ion Beam (FIB). These skills will be integrated to analyze and resolve real 3D‑NAND PFA cases, enabling direct contribution to industrial failure analysis and yield learning.

Deliverable: Analyze and resolve representative 3D‑NAND PFA or equivalent experience cases to build technical depth in failure mechanisms and analysis flow. Based on hands‑on experience, identify cycle‑time bottlenecks, propose improvement concepts with emphasis on automation and AI adoption, one example is SEM image classification, and design controlled experiments to validate their effectiveness, with the goal of enabling measurable PFA cycle‑time reduction.

•Skillset Require: Strong problem‑solving and troubleshooting proficiency, with a keen interest in hands‑on laboratory work and experimental learning. Familiarity with semiconductor fabrication processes is beneficial. Prior exposure to SEM and FIB tools is an advantage but not required, as training will be provided.

•Course of interests: Students from Electrical, Electronics, Materials, Mechanical, or Chemical Engineering, as well as Physics or Chemistry fields, are encouraged to apply. Background or coursework related to semiconductors or wafer fabrication is advantageous but not mandatory.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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