Job Title:
Lead Fab Technology Engineer, Surface Preparation and IntegrationJob Description:
Entegris is seeking a Lead Fab Technology Engineer for Surface Preparation and Integration (SPI) based in Japan to play a pivotal role in solving our customers' most challenging problems and identifying new opportunities in Selective Wet Etch and Clean area. This position will be at the forefront of customer adoption progression of existing and new products, providing technical leadership during launches and commercialization efforts for Entegris' SPI Material Solutions Business Unit.
Responsibilities:
Technical Expertise:
Act as a technical expert in Selective Wet Etch and Clean for Surface Preparation and Integration (SPI) in Asia, supporting business operations.
Lead customer evaluations, ensuring precise execution and alignment with customer buying motives, presented professionally.
Revenue and Market Growth:
Develop strategies to drive revenue and market share growth for Entegris' SPI Material solutions in Asia.
Technical Support and Collaboration:
Provide the necessary technical and application support during customer qualifications.
Partnering with account managers in product presentations and technical discussions.
Identify, develop, and prioritize customer opportunities using Entegris' value selling process.
Active engagement with key equipment OEMs for customer demo and collaboration for new business opportunities.
Interface with Business Unit, and R&D teams to ensure the product pipeline is strategically aligned with customer and industry needs
Customer Relationship Management:
Maintain a database of customer Wet process and Entegris products.
Conduct regular customer reviews to understand ongoing needs and develop account management plans with account managers.
Establish strong customer relationships to become the go-to technical resource for Wet Etch and Clean in the region.
Education and Training:
Educate customers and colleagues on relevant process solutions knowledge.
Product Positioning and Life Cycle Management:
Take responsibility for product positioning and life cycle management to maintain market share.
Team Collaboration and Business Meetings:
Participate in business review meetings with the SPI leadership team.
Represent the region/ platform in local and global opportunity reviews.
Drive and advise on technical roadmap discussions with customers.
Collaborate with functional teams such as account managers, supply chain and quality to support customer requirements and operations.
Travel and Revenue Goals:
Travel within Japan and to other global locations as necessary to support customer engagement (up to 30% travel).
Own and be accountable for the region's SPI revenue goal.
Qualifications: (Knowledge, Skills and Abilities, Education, Experience)
Education and Experience:
Bachelor’s degree in chemistry/ chemical engineering, material science or engineering with 10+ years of experience in Wet Etch and Clean area in semiconductors processing or fab environment/ equipment supplier/ material supplier.
Master’s degree or PhD’s degree in chemistry/ chemical engineering, material science or engineering with 8+ years of experience in Wet Etch and Clean area in semiconductors processing or fab environment/ equipment supplier/ material supplier.
Technical Skills:
Extensive experience on Wet Etch and Clean process development in advanced wafer fab environment (Advanced Logic or Memory Vertical/3D architecture) or a semiconductor equipment company is preferred.
Analytical approach to problem solving; team player and works well under stress.
Experienced in Surface Analytical techniques is a plus.
Location: Tokyo (or close-by areas), Japan specific.
Additional Skills:
Self-directed work ethic with minimal supervision required.
Strong team player is required.
Demonstrated ability to develop and present technical presentations.
Strong verbal and written communication skills for both internal and external audiences.
English-speaking and presentation skill (TOEIC > 600 preferred)
Sales or management experience is a plus.