RELOCATION ASSISTANCE: No relocation assistance available
CLEARANCE REQUIRED FOR START: Yes
CLEARANCE TYPE: Secret
TRAVEL: Yes, 25% of the Time
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
The Northrop Grumman Microelectronics Center is seeking a Senior Program Manager (Level 3) to support the Foundry, Test, and Advanced Packaging Operating Unit onsite in Linthicum, MD.
For more than 70 years, Northrop Grumman’s Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges. Our team develops and deploys next-generation microelectronics & packaging technologies for future defense & commercial systems. We focus on development, prototyping, maturation, and scaling of microelectronics & advanced packaging technologies to meet the needs of our customers.
What You'll Get to Do:
As a Senior Program Manager, you will lead complex, fast-paced programs focused on development, prototyping, and maturation of advanced packaging technologies and microelectronics products. The selected candidate will be responsible for successful performance through all phases of the program lifecycle, from shaping & capture through startup, execution, and closeout. To do so, you will lead cross-functional teams to deliver all contractual requirements to our customers; drive predictable program outcomes in cost, schedule, and technical performance; lead interfaces with internal and external customers, supplier partners, and company support organizations; interface with technical leaders across the industry to identify technology needs & business opportunities; and support transition of our program deliverables to practical use with our customers. Key responsibilities include, but are not limited to:
- Managing multiple, concurrent, fast-paced programs with successful cost, schedule, and technical performance.
- Building high-performance, cross-functional program teams to successfully execute design, manufacturing, and/or test efforts that deliver compelling products & services to our customers.
- Owning program performance through rigorous measurement, analysis, and enforcement of key performance indicators through practices including earned value management, risk & opportunity management, and requirements change control.
- Strategically allocate and optimize program resources, overseeing workforce planning, talent acquisition, and skill gap mitigation to ensure peak productivity.
- Shaping & negotiating contracts, change orders, specifications, budgets, schedule milestones, and key conditions leading to executable program performance.
- Cultivating deep customer & partner relationships based on transparency, disciplined execution, and clear communication of risks, dependencies, and tradeoffs.
- Delivering compelling executive-level briefings and presentations to our customers, executive management, program stakeholders, and outside industry.
- Leading comprehensive stakeholder engagement both internally and with customers, guaranteeing alignment, transparency, and sustained support throughout the program lifecycle.
This position will require up to 25% travel.
Basic Qualifications:
- Bachelor’s Degree with 8 years of relevant experience, Master’s Degree with 6 years of relevant experience, or a PhD with 3 years of relevant experience supporting U.S. Government contracts and/or program management in commercial industry.
- Demonstrated experience leading U.S. government programs, contracts, and/or acquisitions.
- Technical background in the design, research, development, and production deployment of microelectronics and/or advanced packaging technologies.
- Demonstrated experience managing program performance using key performance indicators (KPIs) and program cost, schedule, and technical metrics directly linked to contractual and internal requirements.
- Demonstrated experience successfully managing program financial performance, including budgets, forecasts, revenue, cost, and/or profit and loss (P&L).
- Deep experience with leading teams in a matrixed organization to execute programs’ technical and business operations.
- Demonstrated experience as the lead interface to U.S. Government, defense, and commercial customers to define technical solutions for their microelectronics fabrication and/or packaging needs.
- Expert verbal and written communication skills for preparing and delivering white papers, proposals, technical & programmatic briefings to customers, internal executives, and key stakeholders.
- Ability to travel domestically as required (25% time estimated).
- U.S. citizenship required
- Active U.S. goverment Secret clearance to be considered with the ability to qualify for higher clearances and/or Special Access Programs (SAPs).
Preferred Qualifications:
- Master’s or Ph.D. degree in a science or technology field related to microelectronics and semiconductors.
- 5+ years of experience leading technology development or production programs, operations management, knowledge of RF & digital system products, capabilities and enabling technologies for microelectronics and advanced packaging.
- Detailed knowledge of application specific integrated circuit (ASIC) and packaging design are strongly preferred.
- Demonstrated experience leading or supporting competitive proposal efforts for U.S. Government customers, including proposal development, capture activities, and/or bid submissions.
- Familiarity with Federal Acquisition Regulations (FARs), Defense Federal Acquisition Regulations (DFARs), and Other Transaction Agreements (OTAs).
- Active U.S. government Top Secret clearance.
What We Can Offer You
Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family. Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off and Additional Benefits including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!
Primary Level Salary Range: $0.00 - $0.00
The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.
Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.
Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.
