Microelectronics Packaging Engineer (Level 3/4)

RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE REQUIRED FOR START: No

CLEARANCE TYPE: SCI

TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Space Systems continues to push the boundaries of what is possible in space technology. Join our collaborative team of passionate engineers designing and building mission-critical space sensor payload hardware enabling national security and scientific advancements. We foster a culture where your expertise is valued and your growth is supported every day through purposeful innovation and leadership.

Position Summary:

 

We seek an experienced Electro-Mechanical Engineer (level 3/4) to join our team within the Intelligence Systems Business Unit. The successful candidate will independently lead mechanical design, analysis, integration, and testing for RF and EO aperture designs supporting multiple high-profile satellite programs. This role is ideal for a technically accomplished and strategic engineer who thrives in fast-paced, multidisciplinary environments and is eager to take leadership responsibility. This role will be worked out of Linthicum, MD.

 

The ideal candidate will support development, design, fabrication, and test of various space sensor hardware work products across different program efforts.  The qualified candidate will work with a diverse and talented team of engineers developing innovative and cost-effective systems that support a broad range of products and business areas across the lifecycle of a program.  The candidate will support the design of space hardware and specifically support the mechanical development of micro-circuit technology. The micro-circuit technology will support equipment for antennas, electro-optical sensors, and supporting electronics chassis assemblies such as processors and receivers. The candidate will specifically be involved with micro-electronic devices that are used on tile sensor assemblies as well as circuit card assemblies. The role will also provide an opportunity to be involved with proposals of new space sensors designs and development of payload sensor components that comply with a multitude of customer mechanical requirements. 

 

This position is targeted for micro-circuit development; however, the candidate will have exposure to broader aspects of the overall sensor and system design. A candidate applying to the position would benefit from having prior experience supporting micro-electronic designs, designing for the consideration of space environments, and specifically space sensor elements such as tile assembly development.  This position will report to the Electro-Mechanical Design manager of the Mechanical Systems Technology Department within Hardware Engineering. Minimal travel is expected.

  

Roles and responsibilities may include, but are not limited to:

• Responsible for the mechanical development of advanced micro-circuit design as well as the assemblies that they support.  (Ex. RF Tile Assemblies)

• Responsible for the development of microcircuit advancements that are funded by internal NGC IRAD

• Understanding of all aspects of hardware development. This will encompass all phases of design, including concept and detailed design development, CAD modeling efforts, documentation release, fabrication, integration, factory support and testing

• Responsible for understanding technical performance of mechanical requirements of space program microcircuit hardware or subsystems (tile assemblies) of major satellite programs to assure cost, schedule and technical performance is achieved

• Understand the integration and test process of space hardware and the special tooling that may be required

• Present technical solutions and technical data at milestone reviews

• Understand space environments and impact to space hardware

• Research and develop procedures, methods, and tools for further the development of micro-circuit technology.  This also includes space hardware conformance to documented and derived system requirements

• Support program meetings in developing root cause and corrective actions

• Troubleshoot or support technicians in troubleshooting issues with hardware designs during integration and test and provide suggestions for improvement and optimization

• Facilitate knowledge sharing and mentoring

• Verify space micro-circuit designs and performance by making necessary calculations

• Lead or support department initiatives, recruiting, technology roadmap creation, cross-campus/sector involvement, and NCTA project leadership

 

 Basic Qualifications:

• Principal (Level 3): B.S degree in a STEM field with 5 years of engineering experience; or a Master’s degree in STEM and 3 years of engineering experience.

• Sr. Principal (Level 4):  B.S degree in a STEM field with 8 years of engineering experience; Master’s degree in STEM and 6 years of engineering experience, or a Ph.D. and 3 years of experience

• Experience presenting complex technical programs and concepts to non-technical and technical personnel and customers.

• Ability to successfully read and interpret schematics, block diagrams, sketches, oral and written instructions, manufacturer's specifications/operation manuals, and analyze hardware configurations

• Ability to work independently and collaborate as part of a cross-functional team with other engineers, management, and contractors

• Minimum 2 years of experience with mechanical design and analysis tools; AutoCAD and/or other 3D CAD software packages

• No clearance required to start, but must have the ability to obtain and maintain a TS/SCI security clearance with Poly

• United States Citizenship

Preferred Qualifications:

• Active TS/SCI clearance with Poly

• Minimum 2 years of mechanical micro-circuit design experience

• Experience with printed circuit board fabrication and testing

• Experience with surface mount technology, including process steps to manufacture and test micro-circuits

• Demonstrated technical design support of mechanical microcircuit design.

• Ability to collaborate with multi-disciplinary teams.

• Able to work in a fast-paced environment where multiple projects are being developed and deployed simultaneously

 

Primary Level Salary Range: $108,800.00 - $163,200.00

Secondary Level Salary Range: $135,800.00 - $203,600.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.