Optical Packaging Engineer

PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems. 

Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries. 

Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry—including partners like GlobalFoundries—we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don’t feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure. 

In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining—and that now is the time to scale. 

PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies—including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical—to prepare quantum solutions for real-world impact. 

Quantum computing is not an extension of classical computing. It represents a fundamental shift—and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real. 

Come join us. 

Job Summary:

We are seeking a highly motivated Optical Packaging Associate Engineer help drive our hands-on engineering validations build & process development. The Associate Engineer will build fiber-coupled optical packages with photonic chips and work closely with the optical packaging and operations teams.

Responsibilities:

• Support hand-on manufacturing of of fiber-to-chip packaged chip assemblies.
• Support the development, optimization, and validation of optical packaging and active alignment processes for photonic components and fiber attach assemblies.
• Assist in process characterization activities for optical module packaging, including alignment, adhesive curing, and optical performance evaluation.
• Execute experiments and collect data to improve optical coupling efficiency, process stability, and assembly yield.
• Support NPI (New Product Introduction) activities by contributing to process development, documentation, and production readiness.
• Participate in troubleshooting manufacturing and reliability issues using structured problem-solving methodologies.
• Help develop and maintain process documentation including work instructions, process flows, and control plans.
• Collaborate with cross-functional teams including design, manufacturing, test, and reliability engineering.
• Support equipment setup, calibration, qualification, and maintenance activities for optical assembly processes.
• Work with vendors and internal teams to evaluate materials, tooling, and process improvements.
• Analyze process and metrology data to identify trends and opportunities for yield and quality improvement.

Experience/Qualifications:

• Bachelor’s or Master’s Degree in Engineering, Physics, Materials Science, or related technical field.
• 1–3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing environments (internships and research experience may be considered).
• Basic understanding of optical alignment, fiber optics, and optical measurement techniques.
• Exposure to semiconductor assembly, precision alignment systems, or automated manufacturing equipment.
• Hands-on laboratory or manufacturing experience with precision assemblies and metrology tools.
• Good communication and collaboration skills with cross-functional engineering teams.
• Strong problem-solving skills with the ability to work in a fast-paced development environment.
• Familiarity with photonic integrated circuit (PIC) packaging or optical module assembly is a plus.
• Experience with data analysis tools such as Excel, JMP, MATLAB, or Python is beneficial.
• Understanding of statistical process control (SPC), DOE, or basic yield analysis concepts is a plus.

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.

Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com.

We are not accepting unsolicited resumes from employment agencies.