Principal Engineer, Process Engineering (PEALD SiN)

Job's mission

What you will be working on

• Researching, developing, and optimizing thin film deposition processes, with a focus on metal and dielectric films using PEALD and related technologies.
• Designing and executing complex experiments using Design of Experiments (DOE) and Response Surface Methodology (RSM), and interpreting experimental results.
• Developing new film materials and processes for emerging semiconductor applications based on strong chemistry and materials science fundamentals.
• Actively troubleshooting process and equipment issues through hands-on engagement.
• Participating in and driving structured technical problem-solving using scientific methodologies and industry tools.
• Collaborating with customers and central marketing to define requirements and execute customer demonstrations.
• Supporting product transfer to customers by delivering demonstrations, training field service teams, creating technical documentation, and traveling to customer sites (up to 10%).
• Authoring technical papers and contributing to intellectual property (IP) generation related to process and technology development.

What we are looking for

• PhD with 10+ years or MS degree with 14+ years of relevant industry experience in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field.
• Hands-on experience with PEALD, ALD, PECVD, CVD, Epitaxy, or other thin film deposition technologies.
• Strong understanding of thin film deposition principles and semiconductor process development.
• Experience designing and characterizing deposition processes using first principles and experimental design techniques.
• Ability to independently manage complex process development activities.
• Excellent communication skills in English and Korean, with the ability to clearly explain complex technical concepts.

What sets you apart

• Knowledge of electrical characterization techniques for CMOS devices.
• Experience integrating metal and/or dielectric films into FEOL and BEOL process flows.
• Hands-on experience with materials characterization techniques such as XPS, SIMS, AFM, XRD, TEM, SEM, Raman, or ellipsometry.
• Experience authoring technical publications and/or patents in the semiconductor industry.
• Strong collaboration skills with customers, field teams, and cross-functional stakeholders.