About Marvell
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.
At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.
Your Team, Your Impact
Group Description
The Advanced Packaging Technology Development team develops and qualifies advanced packaging technologies and package architectures that enable Marvell's next-generation AI, cloud, networking, silicon photonics, and co-packaged optics products. Working across product engineering, package architecture, reliability, manufacturing, customers, suppliers, and OSAT partners, the organization drives technology development, qualification, and readiness to enable strategic customer engagements and execute Marvell's long-term product and technology roadmap.
What You Can Expect
Job Responsibilities
- Lead development of thermal and thermo-mechanical technologies for advanced semiconductor packaging platforms.
- Define thermal architecture requirements and technology strategies supporting future AI, networking, silicon photonics, and co-packaged optics products.
- Develop and evaluate advanced cooling solutions including TIMs, vapor chambers, liquid cooling, package-integrated cooling, and emerging thermal technologies.
- Perform thermal, structural, and thermo-mechanical analysis and establish simulation methodologies for advanced package development.
- Correlate simulation models with laboratory measurements, package characterization data, and reliability results to improve design accuracy and predictive capability.
- Investigate thermal and mechanical failure mechanisms including warpage, stress, deformation, delamination, fatigue, and material degradation.
- Work closely with package architects, product engineers, reliability teams, customers, suppliers, and OSAT partners to develop and qualify new technologies.
- Drive technology selection, design tradeoff analysis, and technical decision-making across multiple product programs.
- Mentor engineers and contribute to the development of thermal design practices, simulation workflows, and engineering standards.
- Represent Marvell in technical engagements with customers, suppliers, industry consortia, and external partners as needed.
What We're Looking For
Requirements
- M.S. or Ph.D. in Mechanical Engineering, Materials Science, Engineering Mechanics, or a related engineering discipline.
- 10+ years of thermal, thermo-mechanical, advanced packaging, or semiconductor technology development experience.
- Demonstrated leadership developing thermal and thermo-mechanical solutions for advanced semiconductor packages and heterogeneous integration platforms.
- Deep understanding of heat transfer, structural mechanics, material behavior, package reliability, and failure mechanisms.
- Experience with advanced cooling technologies including TIMs, vapor chambers, liquid cooling, cold plates, immersion cooling, or package-integrated cooling solutions.
- Extensive experience with thermal and thermo-mechanical simulation tools such as ANSYS Mechanical, Icepak, Fluent, Abaqus, COMSOL, or equivalent platforms.
- Proven experience correlating simulations with laboratory measurements, package characterization, and reliability data.
- Experience driving technology development with OSATs, material suppliers, cooling vendors, and cross-functional engineering teams.
- Strong written and verbal communication skills with the ability to influence technical decisions across engineering organizations.
Preferred Qualifications
- Development experience supporting AI accelerators, networking products, silicon photonics, co-packaged optics, or other high-performance computing applications.
- Advanced packaging technologies including 2.5D/3D integration, chiplets, heterogeneous integration, hybrid bonding, and advanced substrates.
- Development of thermal design methodologies, design rules, or technology roadmaps for advanced semiconductor packaging.
- Experience working directly with customers to evaluate thermal requirements and technology solutions.
- Record of technical publications, patents, or industry leadership related to advanced packaging, thermal management, or reliability.
Expected Base Pay Range (USD)
166,520 - 249,500, $ per annum
The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

This role is eligible to participate in Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers, ensuring you are rewarded for your contributions and remain invested in the company's long-term success.

Additional Compensation and Benefit Elements
Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.
Interview Integrity
To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.
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