Want to know if this job is worth applying to?
Ottawa, Ontario, Canada
Onsite
Our Team
Semtech's Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for the data communications and video broadcast industries — powering the interconnects that move data inside the world's largest hyperscaler data centers. Our Packaging Technology team sits at the heart of this mission, bridging the gap between silicon and system through world-class IC package design, signal integrity engineering, and close collaboration with a global network of advanced manufacturing partners.
You will be joining a highly integrated team of digital, analog, physical, and systems engineers who are passionate about solving hard problems at the intersection of speed, density, and reliability. If you thrive in a technically challenging, fast-moving environment where your work directly impacts next-generation Datacenter connectivity products — this is your team.
Job Summary
As a Principal Engineer in IC Package Design and Signal Integrity, you will lead the design and electrical characterization of advanced high-speed IC packages for Semtech's Datacenter connectivity product portfolio. Your primary responsibilities will span 3D electrical signal integrity modeling, IC package layout, and cross-functional collaboration across design, manufacturing, quality, and reliability engineering disciplines.
This role requires a deep understanding of high-speed transmission line behavior, advanced packaging architectures, and the full NPI lifecycle from concept through qualification. You will work closely with internal teams and external manufacturing partners, serving as a key technical authority on package-level signal and power integrity. The ideal candidate brings strong hands-on experience in EDA tooling, RF/SI measurement, and a track record of delivering complex package designs into high-volume production.
Responsibilities
Design high-speed IC packages and Chip-On-Board (COB) solutions to meet new product technical and financial requirements; develop robust solutions that achieve the highest levels of quality and reliability in fast-paced Datacenter connectivity environments.
Perform 3D signal integrity modeling at silicon, package, and system levels, including experimental validation via Scattering Parameter (S-parameter) and Time-Domain Reflectometer (TDR) measurements where required.
Prepare technical reports and application notes for internal teams and external customers/suppliers, covering Signal and Power Integrity (SI/PI), PCB layout guidance, and assembly process instructions.
Design and produce PCB and high-density substrate layouts for reliability qualification and electrical performance evaluation.
Serve as technical interface with manufacturing suppliers throughout new product introduction (NPI), package definition, and design phases; drive alignment between design intent and manufacturing capability.
Identify, evaluate, and launch projects with new strategic suppliers and emerging package technologies to advance Semtech's packaging roadmap.
Mentor junior packaging engineers and contribute to continuous improvement of design methodologies, tools, and workflows.
Minimum Qualifications
Desired Qualifications
Career Growth Philosophy
At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with the support, resources, and opportunities they need to excel — both technically and professionally. Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation and benefits package, including equity participation. We invest in your growth because your success is our success.
The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.
All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.
We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.
We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.
A reasonable estimate of the pay range for this position is $150,000 - $164,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.