Principal Packaging Integration Engineer (2026 New College Graduate)

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries (GF) seeks a hands-on Assembly Process Integration Engineer that will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors meeting customer requirements. The candidate will bring a strong focus on tool-process interactions for each step in a SiPh Flip Chip assembly, with focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal stress plan for chiplet and product module reliability qualifications.

Essential Responsibilities:

• Defines process integration specifications for assembly flow of co-packaged optics modules driving toward cost, yield, and reliability targets.
• Establishment of manufacturing driven design rules.
• Ensures that all packaged products meet a standardized set of quality expectations by driving through product packaging design reviews, materials selection and FMEAs of customer packaging concepts.
• Driving SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
• Provides tools and complex analysis of quality issues and associated financial implications
• Protect the business by ensuring that all necessary requirements are met and that the technology meets the expectations of customers and market to avoid costly re-designs.
• Ensures standardization of site-based quality processes are executed appropriately
• Drives discipline and qualification robustness through a consistent global qualification process
• Typically performs one or more of the following:
  • Perform project management and data analysis
  • Identify and resolve process integration issues and related problems
  • Develop custom or derivative processes to meet customer needs
  • Support new designs with module characterization and design rule development 
  • Work with cross function teams to resolve technical & yield concerns
  • Develop and improve test structures that enable fast and rigorous characterization of process                                                                                        
  • Drive CIP (Continuous improvement plans) to deliver organizational goals

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
• Travel <10% to other GlobalFoundries facilities may be necessary

Required Qualifications:

• PhD, or MS + 2 or more years of experience
• Experience with failure analysis, design of experiments, & packaging process integration.
• Experience in bringing packaged products from development into production.
• Strong written and spoken English communication skills

Preferred Qualifications:

• Materials science, thermal, mechanical, simulation background.
• Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
• Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
• Knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.

Expected Salary Range

$85,000.00 - $146,000.00

The exact Salary will be determined based on qualifications, experience and location.