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Spring, Texas, United States of America, United States of America
Onsite
Description -
At HP, quality & reliability are part of the HP Way and our promise to our customers, partners, and stakeholders. As part of our journey to lead the Future of Work, the HP Personal Systems and Advanced Compute Solutions (ACS) organizations are undergoing a transformative change so that HP quality is a value add that our customers recognize.
We are seeking a highly analytical and experienced Principal Reliability Engineer to join our growing engineering team. In this role, you will be the primary architect, driving the reliability strategy, standards development, and testing of our compute portfolio. This is a highly-collaborative role, working with teams from early R&D through manufacturing to product end-of-life. You will apply advanced Design for Reliability (DFR) methodologies, life modeling, and reliability testing to ensure our products meet the quality expectations and reliability standards required by global customers, as well as understanding and quantifying design margin. You will work cross-functionally with engineering, procurement, supply chain, and Original Design Manufacturer (ODM) teams to identify potential failure modes early and drive implementation of your data-driven solutions through rigorous risk assessment and statistical analysis.
Key Responsibilities
Reliability Data Analysis: Apply advanced numerical and statistical analysis methods to assess accelerated test and field data, including Weibull, Lognormal, and Exponential distributions, to predict field failure rates and inform warranty risk management.
Cross-Functional Leadership: Lead cross-functional teams, collaborate with ODMs and participate on internal teams to negotiate design options and ensure hardware adheres to reliability standards.
Reliability Strategy & Standards Development: Establish reliability goals and validation strategies for new notebook and desktop architectures. Lead standards development for internal reliability benchmarks to ensure alignment with evolving industry requirements and Design-for-Reliability (DFR) principles. Tailor requirements for market segments. Participate in competitive teardowns and analyses.
Accelerated & Environmental Stress Testing: Design and oversee accelerated and environmental stress testing protocols, including thermal/stress testing, HALT (Highly Accelerated Life Testing), and HASS (Highly Accelerated Stress Screening) to validate supplier and vendor reliability claims.
Root Cause & Failure Analysis: Provide expert failure analysis and root cause analysis for complex electrical and mechanical issues (e.g., PCBA micro-cracking, thermal throttling, high-speed signal degradation) discovered during development or in the field. Effectively communicate complex technical information and recommend corrective actions to executives in a clear and concise manner.
Required Technical Expertise
The successful candidate must demonstrate mastery in the following areas:
Life Modeling & Physics of Failure: Expertise in life modeling using Arrhenius (thermal stress), Coffin-Manson (thermal fatigue). and other models to predict product longevity.
Design of Experiments (DOE): Advanced proficiency in statistical design of experiments, specifically Taguchi methods, to optimize design robustness and minimize variance.
Statistical Validation: Ability to conduct Confidence Interval testing and Regression Analysis to validate reliability claims and performance data.
PC Stressors: Deep familiarity with PC-specific environmental stressors and test procedures, including mechanical shock, temperature, vibration, humidity, foreign contamination, and electromagnetic interference (EMI).
Education and Experience
Education: Bachelor’s or Master’s degree in Reliability Engineering, Materials Engineering, Electrical Engineering, Mechanical Engineering, or a related STEM field.
Experience: Typically 10+ years of experience in reliability modeling, hardware validation, or product engineering.
Proven track record of delivering high-volume consumer or commercial electronics.
Preferred Experience: Experience in establishing and revising reliability standards and procedures. Process creation and documentation experience is highly valued.
Preferred Certifications: ASQ Certified Reliability Engineer (CRE) is highly preferred.
Knowledge and Skills
Analytical Tools: Proficiency in reliability data analysis software (e.g., ReliaSoft, JMP, Minitab, etc.,) and electrical design/simulation tools.
Hardware Mastery: Deep understanding of integrated circuitry, power management, thermal management, and mechanical items prone to wear (e.g., hinges, finishes, etc.,) in mobile and desktop form factors.
Leadership: Ability to lead cross-functional programs and projects to improve standardize reliability and manufacturing processes.
Communication: Ability to translate complex failure modes and statistical analysis results into concise business risks for executive stakeholders.
ODM and Vendor Management: Experience auditing supplier reliability capabilities, providing reliability input into supplier contracts and requirements, and driving corrective actions at the factory level.
Impact & Complexity
Impact: Your insights will directly influence business financial outcomes by reducing warranty costs, driving repeat sales, and improving customer Net Promoter Scores (NPS).
Complexity: You will provide innovative solutions to complex, multi-variable problems (e.g., the intersection of firmware bugs and hardware degradation) within established development timelines.
The pay range for this role is $130,700 to $205,200 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:
Health insurance
Dental insurance
Vision insurance
Long term/short term disability insurance
Employee assistance program
Flexible spending account
Life insurance
Generous time off policies, including;
4-12 weeks fully paid parental leave based on tenure
11 paid holidays
Additional flexible paid vacation and sick leave (US benefits overview)
The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Job -
EngineeringSchedule -
Full timeShift -
No shift premium (United States of America)Travel -
Relocation -
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"