Senior Engineer Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Role Summary:  

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.   
  

Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.   
 
 
Main Responsibilities:  

Process Development:   

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.   

• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity   

• Establish and improve process management projects to deliver technology node requirements   

 
Equipment and Materials:   

• Evaluate and promote new equipment and materials to enhance process capabilities   

• Set up process parameters for a variety of semiconductor equipment   

• Evaluate, promote, and plan for new equipment and materials   

 
Quality Improvement:   

• Ensure defense coverage through process, measurement, inspection, and testing   

• Establish correlations between defense mechanisms to identify improvement opportunities   

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities   

 
Collaboration and Coordination:   

• Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives   

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control   

• Ensure smooth transition from new product development, qualification, small volume production to high volume production   

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities  

AI Responsibilities:  

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.  

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. 

Candidate Profile 
Minimum Required Qualifications: 

• PhD with or Master’s degree with ≥3 years, or Bachelor’s degree with ≥5 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field. 

• Semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking and packaging field  

Must Have Technical Skills: 

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.  

• Experience with Visual Basic for automation and tool integration.  

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.  

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.  

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability  

 
 Must Have Soft Skills: 

• Strong analytical and problem-solving capabilities. 

• Outstanding communication, leadership, and stakeholder management skills. 

• Ability to work independently and collaboratively in a fast-paced environment. 

• Ability to work cross-functionally with process, equipment, and reliability teams. 

AI Requirements:  

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.  

Embody Micron’s core values:  

• People – Respect, develop, and empower others  

• Innovation – Drive continuous improvement and breakthrough thinking  

• Tenacity – Show grit and determination  

• Collaboration – Build trust and foster teamwork  

• Customer Focus – Deliver excellence and value  

• Speed – Act with purpose and set the pace