Process Integration Engineer

About Samsung Austin Semiconductor
Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow. 

Come innovate with us!

Position Summary

NTB Team open Position: NTB process integration engineer or NTB module representative (RMG module)

The New Technology Bridge (NTB) team focuses on new technology development, device targeting, and yield and defect improvement. This talented group of team members also handle design weak point optimization via mask DOE, process manufacturability, and new technology qualification.

In your role as the Process Integration Engineer, you'll be responsible for understanding of 8,10,14,28nm process flows, including process integration, yield enhancement, electrical test (ET), reliability, BKMs, and DOEs.

You'll work to design, analyze layout weak points, and verify results using physical measurements (TEM, SEM).

Role and Responsibilities

Here's what you'll be responsible for:
 

• Managing projects related to new technology development and qualification, yield improvement, and other quality KPI improvements.
• Designing, executing, and analyzing experiments.
• Utilizing software to analyze data including statistical analysis;
• Consulting with leadership team on experimental results in order to make decisions about large-scale changes.
• Trouble shooting issues affecting Yield, defect, electrical performance of products.
• Developing Change Point Management plans.
• Communicating technical information with presentation.

Skills and Qualifications

Here's what you'll need:

• Bachelor’s degree in Physics, Chemistry, Electrical Engineering, Chemical Engineering, Materials Science or related field with 2+ years of experience in semiconductor industry (Master's or PhD is preferred)
• In-depth understanding of Replacement Metal Gate (RMG) module integration is preferred.
• Basic understanding of unit processes including thin films deposition, lithography, etch, diffusion, wet process, Cu plating, and CMP.

All positions at Samsung Austin Semiconductor are 5 days onsite.

The current base salary range for this role is between $83,000 - $206,000. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance.

Total Rewards
At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

We offer a comprehensive benefits package, including:

• Medical, dental, and vision insurance

• Life insurance and 401(k) matching with immediate vesting

• Onsite café(s) and workout facilities

• Paid maternity and paternity leave

• Paid time off (PTO) + 2 personal holidays and 10 regular holidays

• Wellness incentives and MORE
   

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

U.S. Export Control Compliance
This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

Trade Secrets Notice
 By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.

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