Onsite
Work Schedule
Standard (Mon-Fri)Environmental Conditions
OfficeJob Description
As part of the Thermo Fisher Scientific team, you’ll discover meaningful work that makes a positive impact on a global scale. Join our colleagues in bringing our Mission to life every single day to enable our customers to make the world healthier, cleaner and safer. We provide our global teams with the resources needed to achieve individual career goals while helping to take science a step beyond by developing solutions for some of the world’s toughest challenges, like protecting the environment, making sure our food is safe or helping find cures for cancer.
Location: Taoyuan
Division: [Clinical Sequencing Division]
We are seeking a Chip Assembly Product Engineer to support new product introduction (NPI), assembly yield improvement, and production ramp of semiconductor devices used in advanced scientific instrumentation.
This role bridges design, wafer fabrication, OSAT assembly, and test to ensure robust, manufacturable, and high-yielding products from first silicon through volume production.
This is a hands-on engineering role ideal for candidates with 0–4 years of semiconductor assembly, packaging, or product engineering experience.
Support product bring-up from wafer sort through final assembly and test
Work with OSAT partners to ensure process capability and yield targets
Monitor assembly yield, analyze defect paretos, and drive root cause investigations
Coordinate failure analysis activities (CSAM, X-ray, cross-section, SEM, etc.)
Support reliability qualification
Assist in resolving manufacturing excursions and yield loss
Review and maintain assembly documentation and process flows
Collaborate with Design, Test Engineering, Quality, and Supply Chain teams
Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or related field
0–4 years of experience in semiconductor assembly, packaging, product engineering, or related manufacturing environment
Understanding of semiconductor assembly processes (die attach, wirebond, molding, singulation, etc.)
Experience analyzing yield data and supporting root cause investigations
Strong analytical and problem-solving skills
Strong written and verbal English communication skills (required for global collaboration)
Experience working with OSAT vendors
Exposure to failure analysis tools (CSAM, X-ray, cross-sectioning)
Knowledge of package reliability and defect mechanisms
Experience supporting NPI or production ramp
Exposure to full product lifecycle from development to high-volume manufacturing
Direct interaction with global engineering teams
Hands-on experience in semiconductor assembly and reliability engineering
Career growth within a global technology organization
Want to know if this job is worth applying to?
