Senior Engineer, APTD Package Health

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Package Health Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

Key Responsibilities 

• Develop and implement DFT strategies for advanced packaging. 

• Conduct simulations for mechanical, thermal, and electrical performance. 

• Perform electrical and mechanical characterization of packages. 

• Analyze test and field data to identify early indicators of package degradation. 

• Collaborate with data scientists to build predictive models for package health. 

• Support root cause analysis and corrective actions for reliability issues. 

Qualifications 

• Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field. 

• 2+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. 

• Hands-on experience with simulation tools and test equipment, working on package characterization, reliability testing or electrical failure analysis. 

• Proficiency in statistics, data analysis and scripting (e.g., Python, MATLAB, JMP). 

• Strong understanding of semiconductor packaging process, material interaction and properties. 

• Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. 

Additional/Preferred Qualifications 

• Experience with AI/ML tools or statistical modeling. 

• Familiarity with JEDEC or other reliability standards. 

• Strong problem-solving and documentation skills

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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