Senior Engineer I, Process Engineering (PECVD)

Job's mission

As a Senior Engineer I, Process Engineering (PECVD) at ASM Korea, you will play a key role in developing, optimizing, and supporting advanced PECVD processes for leading semiconductor customers.
This role is based in Korea, with primary responsibility for supporting Japan-based customers and projects, requiring strong execution capability, deep process understanding, and excellent communication skills in a global environment. You will work closely with customers, field, and global R&D teams to enable high‑volume manufacturing and next‑generation device applications.

What you will be working on

• Develop, optimize, and support PECVD processes for dielectric and functional thin films (including SiO, SiC) for logic, memory, analog, power, and MEMS applications.
• Design, execute, and analyze complex experiments using DOE and RSM, and interpret advanced process and materials characterization results.
• Drive process transfer, customer demonstrations, and high‑volume manufacturing (HVM) support.
• Troubleshoot process and equipment issues through hands‑on engagement and structured problem‑solving methodologies.
• Collaborate with global R&D, field service, and marketing teams to define customer requirements and deliver robust process solutions.
• Produce and present technical documentation, internal reports, and customer-facing materials, ensuring clarity and execution readiness.

What we are looking for

• Master’s degree or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field.
• Hands‑on experience with PECVD or related thin film deposition technologies (e.g., ALD, PEALD, CVD, Epitaxy).
• Strong understanding of thin film materials and semiconductor process integration.
• Experience with materials characterization techniques such as XPS, SIMS, SEM, TEM, AFM, XRD, ellipsometry, or equivalent.
• Ability to work independently in complex, execution‑driven environments and manage multiple technical priorities.
• Fluent English communication skills required for daily collaboration with global and Japan-based stakeholders.
• Willingness to travel to Japan as required to support projects.

What sets you apart

• PhD degree preferred, especially with research or industry experience in PECVD process development.
• Direct experience with SiO and/or SiC film development for advanced device applications.
• Strong background in high‑volume manufacturing (HVM) support and customer‑facing process execution.
• Ability to bridge process technology, equipment behavior, and customer requirements effectively.
• Demonstrated ability to author technical papers, contribute to intellectual property, or present to technical audiences.