Senior Engineer I, Process Engineering (tALD)

Job's mission

As a Senior Engineer II, Process Engineering (tALD) at ASM, you will lead advanced process development focused on thermal Atomic Layer Deposition (tALD) technologies to enable next-generation semiconductor devices. In this role, you will be responsible for developing, optimizing, and transferring high-performance thin film processes, while collaborating closely with customers and cross-functional teams to deliver differentiated solutions aligned with advanced technology nodes.

What you will be working on

• Lead development and optimization of thermal ALD (tALD) processes for metal and dielectric thin films targeting advanced semiconductor applications
• Design and execute complex experiments using Design of Experiments (DOE) and advanced statistical methodologies to optimize process performance and window
• Develop and qualify new precursor chemistries, reaction mechanisms, and deposition conditions for tALD processes
• Analyze and interpret material and film properties using advanced characterization techniques (e.g., SEM, TEM, XPS, SIMS, ellipsometry)
• Drive process integration of tALD films into FEOL/BEOL device architectures and customer flows
• Identify and resolve process and equipment issues through hands-on troubleshooting and root cause analysis
• Collaborate with hardware engineering teams to define tool requirements and improve reactor performance specific to tALD applications
• Work closely with customers, account teams, and global R&D to align process development with technology roadmaps and application requirements
• Support technology transfer by delivering customer demonstrations, technical documentation, and training to field teams
• Contribute to technical publications and intellectual property (IP) generation in tALD process and materials development
• Stay updated on state-of-the-art ALD/tALD technologies and proactively introduce innovative ideas into development programs

What we are looking for

• PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a related discipline, or MS with 5–8+ years of relevant semiconductor industry experience, with strong hands-on experience in Atomic Layer Deposition (ALD) and a clear focus on tALD process development
• Deep understanding of tALD surface reactions, precursor chemistry, and film growth mechanisms, along with proven experience in thin film deposition process development and optimization
• Strong knowledge of metal and dielectric film deposition and integration, including hands-on experience with DOE, data analysis, and process characterization techniques
• Ability to independently lead complex process development activities from concept through transfer, with experience working in semiconductor cleanroom environments
• Strong communication skills in English (Korean preferred), with the ability to clearly articulate complex technical concepts and collaborate effectively with cross-functional teams

What sets you apart

• Experience integrating tALD-based films into advanced logic, memory, or 3D device architectures
• Hands-on experience with selective ALD / Area Selective Deposition (ASD)
• Experience in precursor evaluation and development for thermal ALD processes
• Familiarity with scaling challenges for high aspect ratio (HAR) structures
• Prior experience supporting customer engagement, demonstrations, and process transfer