Software and Engineering Intern Roles - Imaging and Print

Software and Engineering Intern Roles - Imaging and Print

Description -

The following posting is a pipeline requisition, meant to accumulate candidates for 2027 Summer Internships. Qualified applicants will be contacted in concert with the approval and publication of identical, approved positions within HP, Inc.

This opportunity is intended for conversion to a full-time role that will not offer work authorization sponsorship in the future (full-time conversion pending performance evaluation post internship and available headcount). Interested candidates must be currently eligible to work in the US AND must not require work authorization sponsorship in the future. HP, Inc. will not provide any assistance or sign documentation in support of immigration sponsorship including Curricular Practical Training (CPT) or Optional Practical Training (OPT).

About Us
Innovation is in HP’s DNA. From our origins in a Palo Alto garage in 1939, to our current position as one of the world’s leading technology companies, HP has grown to become a leader in technology and corporate culture, inspiring innovators, and entrepreneurs around the globe. 

HP brings together a portfolio that spans printing, personal computing, software, and services to serve more than 1 billion customers in over 170 countries. We are committed to fostering a diverse and inclusive workplace that attracts exceptional talent and to supporting our employees to succeed at all levels. We dream in over 35 languages and share one mission: to engineer experiences that amaze. 

The Program:
Our future success depends on the innovation and fresh ideas students bring to HP, Inc. We are hiring students with a diverse set of skills and experiences to join us, across the different organizations that make us HP, inc. Our intern program is intended to enhance your overall learning experience, give you an opportunity to make an impact, have some fun, and meet great people along the way.  

Join us for a 12-week paid summer internship designed to let you apply your classroom learnings to real world challenges.  Our internships have a thoughtful balance of networking, executive speakers, community involvement, big meaty projects (no paper filing here!) and fun!

The Team: 

Areas of Interest:

Quality Engineering:

• Quality Assurance, Root Cause Analysis, Testing, Process Improvement, Data Analysis, Excel, Product reliability, Validation, characterization and experimental testing, JMP Statistical Software and Minitab, Ability to document findings and provide engineering recommendations

Mechanical Engineering:

• CAD, 3D Modeling, Mechanical Design, Prototyping, Materials, Engineering Analysis, Fluidics and ink-delivery systems, Print-system design and print quality, SolidWorks, Creo/ProEngineer and AutoCAD

Electrical Engineering:

• Circuit Design, Electronics, PCB Design, Electrical Testing, MATLAB, Python

Hardware Engineering:

• Hardware Design, Circuit Analysis, PCB Development, Hardware Testing, Debugging, Electronics, Industrial controls, including Siemens and B&R, Visual Studio, C# and hardware controls
  System integration and lifecycle validation

Embedded Systems / Development:

• C/C++, Python, Microcontrollers, Firmware, Embedded Systems, Debugging, Git

Software Development:

• Python, Java, C/C++, JavaScript, Git, Software Testing, Data Structures

Systems Engineering:

• System Design, Requirements Analysis, Integration, Testing, Troubleshooting, Technical Documentation

Manufacturing Engineering:

• Manufacturing Processes, Process Improvement, Automation, Quality, CAD, Data Analysis

Test Engineering:

• Software/Hardware Testing, Test Automation, Debugging, Troubleshooting, Python, Data Analysis

Firmware Engineering:

• C/C++, Embedded Systems, Microcontrollers, Firmware Development, Debugging, Git

Data Science / Analytics:

• Python, SQL, Data Analysis, Statistics, Machine Learning, Excel

Education and Experience Required:

• 3rd Year of University completed or 1st year of Masters completed--typically a technical degree specialization.

• Has no more than 24 months of prior work experience professionally related to the intern requisition they are applying to (not including internships, teaching assistance, research work, or military experience)

• Able to obtain work authorization in the United States in 2027, and not require sponsorship in the future.

Preferred Majors/Programs:

• Computer Science

• Electrical Engineering

• Mechanical Engineering

• Computer Engineering

• Chemical Engineering

• Materials Science

• Mechatronics Engineering

• Artificial Intelligence/Data Science

Preferred Knowledge and Skills:

• Project experience demonstrating strong analytical, modeling and research skills

• Strong executive-level presentation skills (storyboarding, development, and delivery)

• Demonstrable success in delivering results in a cross-functional team setting

• Ability to handle ambiguity and unstructured work situations

• Team player who supports others and leads executives and peers through logical reasoning and relationship development

• Strong public speaking and workshop/conversation-facilitation skills

• Demonstrated ability to shape and influence ideas and actions of others

• Working knowledge of MS PowerPoint and MS Excel

• Ability to plan experiments, analyze data, and document technical findings.

• Strong problem-solving and troubleshooting skills.

• Attention to detail and commitment to quality and reliability.

• Ability to learn and apply new engineering tools and technologies.

• Interest in collaborating across mechanical, electrical, firmware, manufacturing, and data disciplines.

We are looking for visionaries who are ready to make an impact on the way the world works. At HP, the future is yours to create. Thanks for taking the time to review our job, if you think it is a match to your knowledge and interests please apply today— we are eager to learn more about you. 

HP is an equal opportunity employer:  https://www8.hp.com/h20195/v2/GetDocument.aspx?docname=c08129225 

The pay range for this position is $29 to $35 per hour (applies to US candidates only).  Pay varies by work location, job-related knowledge, skills, and experience. 

Benefits:  

Review HP US benefits: https://www8.hp.com/h20195/v2/GetDocument.aspx?docname=c07065756 

HP offers a comprehensive benefits package for this position, including: 

• Health insurance 

• Dental insurance 

• Vision insurance 

• Long term/short term disability insurance 

• Employee assistance program 

• Flexible spending account 

• Life insurance 

• Generous time off policies, including;   

• 4-12 weeks fully paid parental leave based on tenure 

• 13 paid holidays  

• 15 days paid time off (US benefits overview)  

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.  

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Job -

Administration

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Relocation -

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"