Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
As a Package Design/Development Quality Assurance (DDQA) Senior Manager in Micron’s Global Quality (GQ) organization, you will lead a highly specialized engineering team responsible for enabling the successful introduction of Micron’s most advanced package technologies.
This role is central to ensuring that chip‑package interaction risks, reliability concerns, and customer integration challenges are identified and mitigated early—before they impact product qualification, customer deployment, or field performance. You will work closely with Technology Development, Design, Assembly, and customer‑facing teams to drive deep technical understanding of package‑level failure mechanisms, define robust characterization and reliability strategies, and guide critical engineering trade‑offs.
Beyond execution, this role offers the opportunity to shape next‑generation package technology by driving lessons learned into future designs, influencing industry practices, and publishing technical work that advances Micron’s leadership position. Success requires a leader who can combine technical authority, people leadership, and cross‑functional influence to deliver both near‑term results and long‑term technology impact.
Responsibilities and Tasks
Technical & DDQA Leadership
People & Team Leadership
Technology Advancement & Industry Impact
Operational Excellence & Governance
Experience
10+ years of experience in one or more of the following areas:
• Packaging Technology, Assembly Engineering, Product Quality and Reliability Engineering, and/or Failure
Analysis
Qualifications
• Demonstrated ability to lead and develop senior technical engineers
• Strong knowledge of semiconductor package assembly and surface‑mount processes
• Solid understanding of thermomechanical, thermal, mechanical, and hygroscopic stress effects on package
reliability
• Working knowledge of industry reliability test methods, acceleration models, and sampling statistics
• Experience applying FMEA and structured problem‑solving methodologies (e.g., 8D)
• Strong analytical skills with the ability to translate complex data into clear technical decisions
• Proven ability to collaborate across functions and influence outcomes in complex technical environments
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
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