Staff TPM [L6-2] (TSE/CIC)

본 공고는 재직 임직원을 대상으로 하는 사내 공모 전용입니다. (임직원 추천은 Link로 진행)

This posting is exclusively for internal employees. (Employee referrals are submitted via the Link)

 

지원 시에는 반드시 첨부된 ‘사내 공모 지원서 양식’을 작성한 후, 쿠팡 이메일 계정으로 접수해 주시기 바랍니다.

To apply, please complete the attached ‘Internal Transfer Request Form’ and submit it via your Coupang email address.

• 사내 공모 정책: [Link]
• Internal Transfer Policy: [Link]

 

Company Introduction

We exist to wow our customers. We know we're doing the right thing when we hear our customers say, "How did we ever live without Coupang?" Born out of an obsession to make shopping, eating, and living easier than ever, we're collectively disrupting the multi-billion-dollar e-commerce industry from the ground up. We are one of the fastest-growing e-commerce companies that established an unparalleled reputation for being a dominant and reliable force in South Korean commerce.

Our mission to build the future of commerce is real. We push the boundaries of what's possible to solve problems and break traditional tradeoffs. Join Coupang now to create an epic experience in this always-on, high-tech, and hyper-connected world.

Role Overview

You will lead the architectural vision for our next-generation data centers, transitioning our global footprint from traditional colocation models to high-density AI Factories. You are responsible for the physical and logical blueprint of the facility—ensuring that our "white space" can support 100kW+ racks, liquid-to-chip cooling, and the massive throughput requirements of 800G/1.6T networking.

Responsibilities

• Facility Strategy: Design the "Basis of Design" (BOD) for hyperscale facilities, including site selection, building massing, and modular "pod" scalability.
• Thermal Management: Architect the transition from air-cooled data halls to Hybrid Cooling environments (Direct-to-Chip, Rear Door Heat Exchangers, and Immersion Cooling) to support high-TDP AI chips.
• Power & Energy: Partner with electrical engineers to design high-availability power chains (N+1/2N) capable of supporting 50MW+ of IT load per hall. Evaluate the integration of Small Modular Reactors (SMRs) or hydrogen fuel cells for onsite power.
• Network & Fabric Topology: Define the physical layout for OSFP-based high-radix fabrics. Optimize cabling pathways and "meet-me-room" designs to minimize signal degradation for InfiniBand and RoCE v2 compute planes.
• Modular Construction: Drive the adoption of modular "skid-based" deployments to accelerate construction timelines by 30% without sacrificing reliability or efficiency (PUE).
• Sustainability & ESG: Ensure designs meet 2026 carbon-neutrality standards by implementing waste-heat reuse for local district heating and optimizing Water Usage Effectiveness (WUE). 

Qualifications

• Education 

  • B.Tech/M.S. or Ph.D. in Computer Science, Electrical Engineering, or a related field (or equivalent industrial experience)

•  Required Technical Expertise

  • Physical Infrastructure: Deep understanding of rack densities (moving from 15kW to 100kW+), busways, and floor loading for heavy liquid-cooled systems

  • Hardware Lifecycle: Mastery of the latest server form factors, including E1.S/E3.S storage and the mechanical requirements of NVIDIA Blackwell/Rubin rack systems

  • Networking Standards: Expert knowledge of the physical layer (OSFP/QSFP-DD), fiber types (OM5/Single-mode), and OSPF/BGP routing at the facility scale

  • BIM & Digital Twin: Proficiency in Revit, AutoCAD, and Digital Twin platforms to simulate airflow, power distribution, and maintenance accessibility before breaking ground

• Preferred Qualifications

  • 10+ years in mission-critical facility design or lead architectural roles at a Hyperscaler (AWS, Google, Meta) or Tier-1 Provider (Equinix, Digital Realty)

  • Expertise in Uptime Institute Tier Standards and LEED Platinum certifications

  • Experience with "AI-driven DCIM" (Data Center Infrastructure Management) tools for predictive maintenance

• Domain Skills Needed

  • Cooling: Direct-to-Chip (DLC), CDU Integration, Water-Side Economizers

  • Compute: GPU Cluster Architecture, DPU Integration (BlueField)

  • Network: 800G/1.6T OSFP Optics, Fiber Density, OSPF Routing

  • Storage: NVMe-over-Fabrics (NVMe-oF), E1.S EDSFF

  • Construction: Modular Design, Prefabricated Power Skids, BIM

Recruitment Process and Others

• Recruitment Process 

1. Application Review - Phone Interview - Onsite (or Virtual Onsite) Interview – Offer 
2. The exact nature of the recruitment process may vary according to the specific job and may be changed due to scheduling or other circumstances. 
3. Interview schedules and the results will be informed to the applicant via the e-mail address submitted at the application stage. 

• Things to Consider 

1. This job posting may be closed prior to the stated end date for application if all openings are filled.    
2. Coupang has the right to rescind an offer of employment if a candidate is found to have submitted false information as part of the application process.    
3. Coupang does not discriminate against disabled applicants or those with veteran status. We are proud to offer equal opportunities for all applicants. 

• Privacy Notice 

1. Your personal information will be collected and managed by Coupang as stated in the Application Privacy Notice located HERE. 

• Document Return Policy 

1. This notification is given pursuant to Article 11 (6) of the Fair Hiring Procedure Act.  
2. A job applicant, who has applied but not been finally selected for a position at Coupang (the “Company”), may request the Company to return his/her hiring documents submitted pursuant to the Fair Hiring Procedure Act.  However, this will not apply where the hiring documents were submitted via the website of the Company or e-mail, or where the job applicant submitted those documents voluntarily without a request from the Company.  In addition, if the hiring documents were destroyed due to a natural disaster or any other reasons not attributable to the Company, such documents will be deemed to have been returned to the job applicant. 
3. A job applicant who wishes to request the return of his/her hiring documents pursuant to the main sentence of paragraph 2 above should fill out a “Request for Return of Hiring Documents” [Annex Form No. 3 in the Enforcement Rule of the Fair Hiring Procedure Act] and submit the request to the Company by email (recruitingops@coupang.com) In such case, within fourteen (14) days from the date of identifying the receipt of the request, the Company will send the hiring documents to the job applicant’s designated address via registered mail.  Please be informed that the job applicant is required to pay the postage on the registered mail. 
4. In preparation for a job applicant’s request for the return of hiring documents pursuant to the main sentence of paragraph 2 above, the Company shall retain the original hiring documents submitted by the job applicant for 180 days from the completion of the recruiting process.  If no request is made until the end of this period, all of his/her hiring documents will be destroyed immediately in accordance with the Personal Information Protection Act. 
5. The above paragraphs 1 - 4 shall only apply when the labor-related laws of Korea govern the application. They are otherwise not applicable.

 

Equal Opportunities for All

Coupang is an equal opportunity employer. Our unprecedented success could not be possible without the valuable inputs of our globally diverse team.

 

반드시 첨부된 ‘사내공모지원서 양식’을 작성 후 제출하여 주시기 바랍니다.

Please complete the attached Internal Transfer Request Form and submit.

반드시 쿠팡 이메일 계정으로 지원해 주시기 바랍니다.

Please make sure to apply with your Coupang e-mail address.