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서울특별시, 대한민국
Onsite
Define end-to-end thermal design across NPU/ASIC package → PCB → card (PCIe FHFL/HHHL, OAM, SXM) → system (server chassis) levels, selecting and designing heatsinks, heat pipes, vapor chambers, cold plates, and TIM
Evaluate trade-offs across cooling approaches — air, liquid, 2-phase, and immersion — and run CFD simulations (FloTHERM, Icepak) including EM-thermal co-simulation using power maps from HFSS/SIwave/PowerDC
Validate thermal performance through wind tunnel testing, hands-on temperature measurement (thermocouples, IR cameras, RTDs), and DOE-based simulation-to-measurement correlation
Support reliability testing including thermal cycling and burn-in
Partner with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware, and negotiate thermal specifications with OEM/ODM and hyperscale customers
Author thermal design guides, reference designs, and test reports, and ensure compliance with form-factor standards (OCP OAM, PCIe CEM, NVIDIA SXM, etc.)
Thermal Modeling & Simulation: Utilize computational fluid dynamics (CFD) to simulate heat transfer and fluid flow.
System Design: Design active and passive cooling solutions, including heatsinks, fans, liquid cooling coldplate.
Thermal Testing: Evaluation for NPU card thermal performance with using multi temp recorder and FLIR camera or thermocouples.
Collaboration: Work closely with electrical, mechanical, and manufacturing teams to integrate thermal solutions into packaged hardware.
Experienced GPU or NPU card development or server development for datacenter
Flotherm or Icepak preferred
English communication for business level
Positive and proactive engineer
Dongtan / Seoul
The primary work location for this position is Dongtan, with the option to work in either Dongtan or Seoul. Candidates who can work in Dongtan are preferred.
recruit@furiosa.ai