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Catania, Sicilia, Italia
Onsite
About the role
We are seeking a skilled and detail-oriented Mechanical Designer to join our Power Modules and Power Packages R&D team. The role focuses on the mechanical design and integration of advanced power modules and discrete packages, with a strong emphasis on assembly process compatibility, thermal management, reliability, and manufacturability. The ideal candidate will contribute to the development of next-generation solutions based on SiC and GaN technologies for traction and industrial applications.
Design mechanical structures for power modules and packages, including housings, substrates, interconnects, and cooling systems.
Integrate mechanical design with assembly process requirements, including:
Sintering (Ag or Cu)
Gel-filling and potting
Press-fit and soldering
Wire bonding and clip bonding
Encapsulation and molding
Large area soldering / sintering
Collaborate with process engineers to ensure mechanical designs are compatible with automated and semi-automated assembly lines
Develop 3D CAD models and detailed drawings using tools such as SolidWorks, Inventor or CATIA
Perform mechanical simulations (e.g., stress, vibration, thermal expansion) using FEA tools (e.g., ANSYS, COMSOL) is a nice to have
Support prototyping, testing, and validation of mechanical designs in collaboration with internal labs and external partners
Contribute to design-for-manufacturing (DFM) and design-for-reliability (DFR) initiatives
Interface with suppliers and manufacturing teams to ensure feasibility and quality of mechanical components
Document design processes, specifications, and test results in compliance with internal standards and industry regulations
Coordinate and manage design documentation activities across the mechanical design team, ensuring proper document control, version management, release processes, and data consistency
Bachelor’s or Master’s degree in Mechanical Engineering or related field
3+ years of experience in mechanical design, preferably in power electronics or semiconductor packaging
Proficiency in CAD and FEA tools
Solid understanding of materials used in power electronics (metals, ceramics, polymers) and their mechanical/thermal properties
Experience with assembly processes relevant to power modules and packages
Familiarity with thermal management techniques (e.g., heat sinks, TIMs, liquid cooling)
Knowledge of reliability standards (e.g., JEDEC, IEC) and environmental testing
Strong problem-solving skills and ability to work in cross-functional teams
Fluent in English; Chinese would be a plus
Available to travel for 25% of working time
Preferred Skills
Experience with SiC , GaN or IGBT -based power modules
Background in traction or industrial applications
Exposure to processes and manufacturing or advanced packaging technologies
Knowledge of PCB design and integration
What We Offer
Opportunity to work on cutting-edge technologies in a collaborative and innovative environment
Strong connection with academic and industrial partners
Career development in a global organization with a focus on sustainability and electrification
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.
