We are seeking a highly specialized engineer to focus on advanced liquid cooling and CDU systems for high‑density data centers and AI computing. This role drives end‑to‑end R&D, architecture, and productization of chip‑level liquid cooling and Cooling Distribution Unit (CDU) solutions to support both China domestic and global international markets.
What you will do:
1. Lead the design, development, and optimization of direct liquid cooling systems for high‑heat‑flux chips, servers, and racks, including the related heat capture or heat transfer products.
2. Own the full lifecycle development of CDU (Cooling Distribution Unit) systems, including architecture, component selection, fluid control logic, and performance validation.
3. Taking advantage of detailed thermal and fluid simulation, analysis, and optimization tools for liquid cooling system design.
4. Define system requirements, performance targets, reliability standards, and test plans for liquid cooling and CDU products for both China and global markets.
5. Drive reliability and safety design: leak prevention, corrosion resistance, anti‑condensation, material compatibility, and FMEA.
6. Support prototype testing, testing validation, and mass production transfer for liquid cooling and CDU solutions.
7. Collaborate with global engineering teams, customers, and suppliers to align with industry standards (ASHRAE, OCP, ODCC) and market requirements.
8. Support next‑generation liquid cooling technology roadmap setting up including high‑efficiency CDU control, two‑phase cooling, advanced coolants, and low‑PUE architectures.
9. Provide technical leadership and support for global projects, solution validation, and cross‑regional product alignment.
what we want:
1. Bachelor’s or above in Thermal Engineering, Refrigeration, Mechanical Engineering, Energy & Power, Fluid Mechanics, or related field; Master/PhD preferred.
2. 5+ years of hands‑on experience in liquid cooling systems, CDU development, or server/data center thermal management.
3. Deep expertise in:
a) CDU system architecture, fluid control, pumps, heat exchangers, and valves
b) High‑heat‑flux thermal management for AI/GPU/CPU/HPC
c) Proficiency in thermal/fluid simulation tools and 3D/CAD tools (Creo/SolidWorks/Inventor, Valut).
4. Familiarity with industry standards: ASHRAE, OCP, GB, CE, UL for global markets.
5. Experience working on global or cross‑border engineering projects is a strong plus.
6. Professional working proficiency in English & Chinese; bilingual communication required.
7. Strong project execution, problem‑solving, and cross‑functional teamwork skills.
What We Offer
● Competitive global compensation & benefits
● World‑class R&D platform in liquid cooling and thermal management
● Career path for technical expert or engineering management
● Opportunities to work on global data center & AI infrastructure projects
● Innovation‑driven culture and patent development support
Preferred Qualifications
● Experience with AI computing, high‑density racks, or cloud data center customers.
● Hands‑on experience with advanced thermal management, liquid cooling / CDU systems.
● Knowledge of data center PUE, energy efficiency standards, and reliability design.
● Familiarity with IPD, agile, or stage‑gate NPD processes.
Competencies
● A positive attitude focused on understanding, anticipating and responding to the needs of the market and customers, both internal and external with Customer‑centric thinking
● Critical thinking skills adequate to understand risk and recommend options accordingly.
● Excellent communication skills and strong executive presence with Cross‑functional influence.
● Sense of urgency and ownership.
● Innovation and market sensitivity